The IPC-WHMA-A-620 is a revision of the IPC-6520 standard for the Dry-Conduction Least-Times method of measuring the lead-free solder joint quality of electronic kit, board, and component. The IPC-WHMA-A-620 contains a new, easier to use numerical scale, and an extensive revision of the indicator chapter. Also included are amendments that are becoming mandatory with IPC-9291, IPC-9390, and IPC-9610-2003.
IPC-WHMA-A-620 is the newest addition to the mgtbook.com website , being released August 2006. The IPC-WHMA-A-620 Standard for Dry-Condition Inspection of Solder Joints, End-Product Inspection of Electronic Basics and Chip and Ball Assemblies, including the Elimination of Differences Between Different Uses and Condition, and the Testing and Analysis of Solder Joints in Electronic Kits, Boards, Assemblies, and Components With the Discontinuation of IPC-61010, and Application for IPC-7610
The IPC-WHMA-A-620 standard is the most recent addition to the mgtbook.com website . PBCI has been closely involved in developing this standard to help meet requirements and enhance customer satisfaction, generating company growth, and fostering employee pride through the continual improvement of its management systems.
The IPC-WHMA-A-620 standard was developed by the Welding Materials Institute, in response to the Rework, Modification and Repair of Electronic Assemblies (R/M/R-EA) Committee cosponsored by the Institute of Electrical and Electronic Engineers and the American Board of Industrial Hygiene, with the intent of promoting rework procedures for electronic assemblies and printed circuit boards in the electronics industry.
It is a sine qua non condition of IPC/WHMA that a cadastral image in electronic form or map coordinates for the entire production and inspection process is available for review and examination in real-time. This condition has been carefully addressed in documents IPT-50, IPT-90, IPT-107, IPT-1081 (all available at www.ipc.org/ipcpubs/ipcpubs.htm). 7211a4ac4a